30 March 2010 Simplified "Litho-Cluster-Only" solution for double patterning
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Double patterning is one of the enabling techniques to allow for further shrinking of devices in the future. Many different solutions, like LELE (Litho-Etch-Litho-Etch) and LPL (Litho-Process-Litho), have been investigated in the past years. In this paper a simplified - "Litho-Cluster-Only" - solution for double patterning is presented. This topcoat-less thermal freeze process has high capability of reaching 26 nm 1:1 LS. In addition it is shown that defect counts for the thermal freeze process approach defect numbers for high end immersion processes.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
H. Tanaka, K. Hoshiko, T. Shimokawa, H. F. Hoefnagels, D. E. Keller, S. Wang, O. Tanriseven, R. Maas, J. Mallman, K. Shigemori, C. Rosslee, "Simplified "Litho-Cluster-Only" solution for double patterning", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76391V (30 March 2010); doi: 10.1117/12.848462; https://doi.org/10.1117/12.848462


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