30 March 2010 Simplified "Litho-Cluster-Only" solution for double patterning
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Abstract
Double patterning is one of the enabling techniques to allow for further shrinking of devices in the future. Many different solutions, like LELE (Litho-Etch-Litho-Etch) and LPL (Litho-Process-Litho), have been investigated in the past years. In this paper a simplified - "Litho-Cluster-Only" - solution for double patterning is presented. This topcoat-less thermal freeze process has high capability of reaching 26 nm 1:1 LS. In addition it is shown that defect counts for the thermal freeze process approach defect numbers for high end immersion processes.
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H. Tanaka, K. Hoshiko, T. Shimokawa, H. F. Hoefnagels, D. E. Keller, S. Wang, O. Tanriseven, R. Maas, J. Mallman, K. Shigemori, C. Rosslee, "Simplified "Litho-Cluster-Only" solution for double patterning", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76391V (30 March 2010); doi: 10.1117/12.848462; https://doi.org/10.1117/12.848462
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