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30 March 2010 High contact angle fluorosulfonamide-based materials for immersion lithography
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Abstract
Fluoroalcohol-containing materials have found considerable use in 193 nm immersion topcoat and topcoat-free immersion resist materials due to their good water contact angles and base-dissolution properties. Trifluoromethanesulfonamide-containing materials are another alternative which have been explored for use in 193 nm photoresist and immersion topcoat applications; however, fluorosulfonamide materials have suffered from issues such as low water contact angles. In this paper, we report the synthesis of a series of fluorosulfonamide-containing methacrylate materials with water contact angle and base dissolution performance that rivals or exceeds that of comparable fluoroalcohol-based materials.
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Daniel P. Sanders, Linda K. Sundberg, Masaki Fujiwara, Yoshiharu Terui, and Manabu Yasumoto "High contact angle fluorosulfonamide-based materials for immersion lithography", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763925 (30 March 2010); https://doi.org/10.1117/12.847257
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