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30 March 2010 High contact angle fluorosulfonamide-based materials for immersion lithography
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Fluoroalcohol-containing materials have found considerable use in 193 nm immersion topcoat and topcoat-free immersion resist materials due to their good water contact angles and base-dissolution properties. Trifluoromethanesulfonamide-containing materials are another alternative which have been explored for use in 193 nm photoresist and immersion topcoat applications; however, fluorosulfonamide materials have suffered from issues such as low water contact angles. In this paper, we report the synthesis of a series of fluorosulfonamide-containing methacrylate materials with water contact angle and base dissolution performance that rivals or exceeds that of comparable fluoroalcohol-based materials.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daniel P. Sanders, Linda K. Sundberg, Masaki Fujiwara, Yoshiharu Terui, and Manabu Yasumoto "High contact angle fluorosulfonamide-based materials for immersion lithography", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763925 (30 March 2010);

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