3 March 2010 Modeling of double patterning interactions in litho-cure-litho-etch (LCLE) processes
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Abstract
This paper uses advanced modeling techniques to explore interactions between the two lithography processes in a lithocure- etch process and to qualify their impact on the final resist profiles and process performance. Specifically, wafer topography effects due to different optical properties of involved photoresist materials, linewidth variations in the second lithography step due to partial deprotection of imperfectly cured resist, and acid/quencher diffusion effects between resist materials are investigated. The paper highlights the results of the simulation work package of the European MD3 project.
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Andreas Erdmann, Andreas Erdmann, Feng Shao, Feng Shao, Juergen Fuhrmann, Juergen Fuhrmann, Andre Fiebach, Andre Fiebach, George P. Patsis, George P. Patsis, Peter Trefonas, Peter Trefonas, } "Modeling of double patterning interactions in litho-cure-litho-etch (LCLE) processes", Proc. SPIE 7640, Optical Microlithography XXIII, 76400B (3 March 2010); doi: 10.1117/12.845849; https://doi.org/10.1117/12.845849
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