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3 March 2010 Predicting and reducing substrate induced focus error
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The ever shrinking lithography process window requires us to maximize our process window and minimize tool-induced process variation, and also to quantify the disturbances to an imaging process caused upstream of the imaging step. Relevant factors include across-wafer and wafer-to-wafer film thickness variation, wafer flatness, wafer edge effects, and design-induced topography. We quantify these effects and their interactions, and present efforts to reduce their harm to the imaging process. We also present our effort to predict design-induced focus error hot spots at the edge of our process window. The collaborative effort is geared towards enabling a constructive discussion with our design team, thus allowing us to prevent or mitigate focus error hot spots upstream of the imaging process.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bernhard Liegl, Brian Sapp, Kia Low, Stephen Greco, Timothy Brunner, Nelson Felix, Ian Stobert, Kourosh Nafisi, and Chandrasekhar Sarma "Predicting and reducing substrate induced focus error", Proc. SPIE 7640, Optical Microlithography XXIII, 76400Z (3 March 2010);

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