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3 March 2010 Improvement in process window aware OPC
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Abstract
In this paper, we present some important improvements on our process window aware OPC (PWA-OPC). First, a CDbased process window checking is developed to find all pinching and bridging errors; Secondly, a rank ordering method is constructed to do process window correction; Finally, PWA-OPC can be applied to selected areas with different specifications for different feature types. In addition, the improved PWA-OPC recipe is constructed as sequence of independent modules, so it is easy for users to modify its algorithm and build original IPs.
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Xiaohai Li, Yasushi Kojima, Hironobu Taoka, Akemi Moniwa, Matt St. John, Yang Ping, Randall Brown, Robert Lugg, and Sooryong Lee "Improvement in process window aware OPC", Proc. SPIE 7640, Optical Microlithography XXIII, 76402O (3 March 2010); https://doi.org/10.1117/12.849904
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