2 April 2010 Design intention application to tolerance-based manufacturing system
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Abstract
Continuous shrinkage of design rule (DR) in ultra-large-scale integrated circuit (ULSI) devices brings about greater difficulty in the manufacturing process. The keys to meeting small process margin are adequate extraction of critical dimension (CD) tolerance for each object and budgeting the tolerance for each process step. Furthermore, to extract adequate tolerance, design intent in terms of electrical behavior should be carefully considered. Electrical behavior is carefully verified in both cell and chip design phases with respect to timing, IR drop, signal integrity, crosstalk, etc., using various electronic design automation (EDA) tools. However, once the design data is converted to layout data and signed off, most of the design intention is abandoned and unrecognized in the process phase. Thus, instead of essential tolerance according to layout-related design intention, uniform and redundant tolerance is used, and therefore excess tolerance is assigned for some layouts. To solve the problem described above, a tolerance-based manufacturing system utilizing flexible layout-dependent speculation derived from design intention has been discussed. In this paper, a test flow is developed and application to 45nm node test chip is examined.
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Sachiko Kobayashi, Satoshi Tanaka, Suigen Kyoh, Shimon Maeda, Masanari Kajiwara, Soichi Inoue, Koji Nakamae, "Design intention application to tolerance-based manufacturing system", Proc. SPIE 7641, Design for Manufacturability through Design-Process Integration IV, 76410L (2 April 2010); doi: 10.1117/12.846542; https://doi.org/10.1117/12.846542
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