9 April 2010 Micro patterning processes for thin film nitinol endografts and evaluation of endothelialization in swine model
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Abstract
Micro features were created in thin film nitinol using a novel lift-off process to create an endovascular biomedical device. This manuscript describes fabrication problems with wet etching and introduces an effective way, named "Lift-off" process to solve undercut and non-uniform pattern issues. Two lift-off processes (i.e., lift-off I and II) are discussed. Lift-off I process has fracture issues and the film peels off the substrate due to high aspect ratio post structures. Lift-off II process use the film on the top of the Si substrate to fabricate various shape patterns (i.e., ellipse, diamond, circle, square, etc.) in the range of 5~60μm. The lift-off II process shows smooth and well aligned micro patterns in thin film nitinol. In-vivo tests in swine were performed to evaluate the endothelial tissue growth through fabricated micro patterns. Angiography and SEM images show patency of the artery and a uniform endothelial layer covering the device without thromobosis.
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Youngjae Chun, Daniel S. Levi, K. P. Mohanchandra, Allan W. Tulloch, David A. Rigberg, Fernando Vinuela, Fernando Vinuela, Gregory P. Carman, "Micro patterning processes for thin film nitinol endografts and evaluation of endothelialization in swine model", Proc. SPIE 7650, Health Monitoring of Structural and Biological Systems 2010, 76502T (9 April 2010); doi: 10.1117/12.847588; https://doi.org/10.1117/12.847588
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KEYWORDS
Thin films

Silicon

Wet etching

Etching

Silica

Copper

Tissues

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