A femtosecond pulsed Ti: sapphire laser micro-manufacturing system was used to investigate the ablation characteristics
and material removal mechanisms of wide band gap mold material SiC in theoretical and experimental aspects. Through
percussion and parallel processing methods, two kinds of microstructures regarding craters and grooves, which had
important specifically applications in micromachining and replication manufacturing, were fabricated in air respectively.
Scanning Electron Microscopy (SEM), Talysurf Profilometer (Talysurf), Atomic Force Microscope (AFM) and Optical
Microscope (OM) were used to identify and measure the morphological characteristics and chemical composition of the
mold material surface before and after processing. The ablation threshold and waist radius were determined according to
the numerical relationship between micro craters and laser fluencies, whose results were 0.31J/cm2 and 32μm,
respectively. Meanwhile, the interacting procedures of samples and photons showed two stages, which were called
optical and thermal penetration, with corresponded characteristics 0.13J/cm2 and 0.61J/cm2. Besides, the femtosecond laser repetition rate, pulse numbers, pulse energy and the scanning velocity effect on the modification microstructures
surface geometry were examined systematically. Furthermore, the wide band gap mold sample SiC, combining with the
micro grooves and craters' topography, material removal mechanisms were also analyzed in detail.