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6 October 2010 Research on the planarizaion of the large optic wafer in the fast polishing process
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Proceedings Volume 7655, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 765514 (2010) https://doi.org/10.1117/12.863594
Event: 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies, 2010, Dalian, China
Abstract
This paper researches on the planarization of the large optic wafer in the fast polishing process (FPP). In the FPP, the MRR (material removal rate) of the large optic wafer can reach 5~10 um/h. However, the planarization of the wafer is still a problem. Thus, this paper uses the revised skin model to analyze the non-uniform pressure distribution which results in the non-planarization of the wafer. At last, some experiments are done to see which parameter can be chosen to avoid the non-uniform pressure distribution and get the good wafer planarization.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wei Yang, Jing Lin, and YinBiao Guo "Research on the planarizaion of the large optic wafer in the fast polishing process", Proc. SPIE 7655, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 765514 (6 October 2010); https://doi.org/10.1117/12.863594
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