22 October 2010 Moiré fringe method of using warping deformation measurement of electronic components
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Abstract
Computers, mobile phones, cameras and video equipment and other electronic products, Moving in the light, thin, small, high speed, high reliability, multi-functional aspects of development, Namely, 3G technology and the SOC of. Therefore, the various components of the packaging technology have become increasingly demanding, Electronic components of residual stress after encapsulation and the use of temperature changes during, Body will be made electronic packaging warpage, Seriously affect the quality of the product. Therefore, to establish a set of micron, sub-micron-level detection method for testing. In this paper, Moiré fringe method to measure warpage of electronic packages body volume, Was first proposed application of Rayleigh-Sommerfeld diffraction theory, Proof presented in this paper with a small spacing diffraction grating problems arising from the assumption can be overcome, Greatly improved the precision deformation measurement of electronic components.
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Yanping Huang, Biaobing Huang, Hongji Xu, Dongmei Yan, Wenpeng Li, "Moiré fringe method of using warping deformation measurement of electronic components", Proc. SPIE 7657, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 76571K (22 October 2010); doi: 10.1117/12.866630; https://doi.org/10.1117/12.866630
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