3 May 2010 Low-power XGA thermal camera for ground applications
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Abstract
The advent of uncooled infrared, XGA (1024×768) focal plane arrays (FPAs) enables new applications for ground vehicles and soldier equipment. A low-power digital imaging module, based on a 17μm-pitch FPA, has been developed and packaged in a rugged housing for demonstration in a distributed aperture system. Cameras and the embedded thermal imaging modules have been delivered during 2009 and the module will be commercially available in 2010. This new capability can extend the performance of existing uncooled ground-based systems. Some background is presented. The product is described and several applications are introduced.
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Stanley Kummer, "Low-power XGA thermal camera for ground applications", Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 76600C (3 May 2010); doi: 10.1117/12.851738; https://doi.org/10.1117/12.851738
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