Over the past two years Raytheon has made a major investment aimed at establishing a high volume uncooled
manufacturing capability. This effort has addressed three elements of the uncooled value stream, namely bolometer
fabrication, packaging and calibration/test.
To facilitate a low cost / high volume source of bolometers Raytheon has formed a partnership with a high volume
200mm commercial silicon wafer fabrication. Over a 12 month period Raytheon has installed 200mm VOx deposition
equipment, matched the metrology used on the Raytheon 150mm line, transferred the process flow used to fabricate
Raytheon's double layer bolometer process and qualified the product. In this paper we will review the process transfer
methodology and bolometer performance.
To reduce bolometer packaging cost and increase production rates, Raytheon has implemented an automated packaging
line. This line utilizes automated adhesive dispense, component pick and place, wire bonding and solder seal. In this
paper we will review the process flow, qualification process and line capacity
Calibration and test has traditionally been performed using a number of temperature chambers, with increased
throughput being obtained by adding more chambers. This comes at the expense of increased test labor required to feed
the chambers and an increased energy and floor space foot print. To avoid these collateral costs, Raytheon has
implemented an automated robotic calibration cell capable of performing in excess of 5,000 calibrations a month. In this
paper we will provide an overview of the calibration cell along with takt time and throughput data.