Transfer of micro/nano-scale pillars and wires on conducting thermoplastic composite coated arbitrary substrates

Logeeswaran V. Jayaraman; Matthew Ombaba; Aaron M. Katzenmeyer; M. Saif Islam

doi:10.1117/12.851762

28 April 2010 Transfer of micro/nano-scale pillars and wires on conducting thermoplastic composite coated arbitrary substrates

Logeeswaran V. Jayaraman, Matthew Ombaba, Aaron M. Katzenmeyer, M. Saif Islam

Author Affiliations +

Proceedings Volume 7683, Energy Harvesting and Storage: Materials, Devices, and Applications; 768313 (2010) https://doi.org/10.1117/12.851762
Event: SPIE Defense, Security, and Sensing, 2010, Orlando, Florida, United States

Abstract

In this paper, we demonstrate an approach to simultaneously transfer single crystal devices in the shape of vertically oriented 1-D silicon micropillars, while establishing a direct electrical and mechanical connection to a target surface of any topology using an innovative harvest/lift-off process coupled with a conducting thermoplastic composing of polyaniline (PAni) and polymethylmethacrylate (PMMA) composite. The mixture acts as a stable anchoring layer and as a conducting layer for the bottom electrode. The insulating layer comprised of PMMA while the top electrode can be formed by evaporating thin metal films.

Citation Download Citation

Logeeswaran V. Jayaraman, Matthew Ombaba, Aaron M. Katzenmeyer, and M. Saif Islam "Transfer of micro/nano-scale pillars and wires on conducting thermoplastic composite coated arbitrary substrates", Proc. SPIE 7683, Energy Harvesting and Storage: Materials, Devices, and Applications, 768313 (28 April 2010); https://doi.org/10.1117/12.851762

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