Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass

M. K. Bhuyan; F. Courvoisier; P.-A. Lacourt; M. Jacquot; L. Furfaro; M. J. Withford; J. M. Dudley

doi:10.1117/12.854767

4 June 2010 Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass

M. K. Bhuyan, F. Courvoisier, P.-A. Lacourt, M. Jacquot, L. Furfaro, M. J. Withford, J. M. Dudley

Proceedings Volume 7728, Nonlinear Optics and Applications IV; 77281V (2010) https://doi.org/10.1117/12.854767
Event: SPIE Photonics Europe, 2010, Brussels, Belgium

Abstract

Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.

Citation Download Citation

M. K. Bhuyan, F. Courvoisier, P.-A. Lacourt, M. Jacquot, L. Furfaro, M. J. Withford, and J. M. Dudley "Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass", Proc. SPIE 7728, Nonlinear Optics and Applications IV, 77281V (4 June 2010); https://doi.org/10.1117/12.854767

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