27 May 2010 Writing wavy metal 1 shapes on 22-nm logic wafers with less shot count
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Proceedings Volume 7748, Photomask and Next-Generation Lithography Mask Technology XVII; 77480X (2010); doi: 10.1117/12.866971
Event: Photomask and NGL Mask Technology XVII, 2010, Yokohama, Japan
Abstract
The metal 1 layer for the 22 nm logic node will require complex "wavy" shapes. These shapes are decorations on main features and require highly accurate printing in order to meet CD requirements. Despite attempts to reduce mask shot count by lining up the left-right or top-bottom jogs of the edges, the explosion in the required shot count is considered inevitable. This paper demonstrates a new mask writing method using model-based mask data preparation (MB-MDP), on a production e-beam mask writer. MB-MDP is a complementary technology to conventional fracturing. It incorporates e-beam simulation as an integrated part in order to determine the dose and shape of the overlapping shots to draw complex mask shapes with less shot count. Specifically, the new method writes these "wavy" metal 1 wires accurately with a significant reduction in shot count. Resist-exposed SEM images will be shown that validate the mask simulation results. A shot count comparison will be made with conventional methods.
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Harold R. Zable, Aki Fujimura, Tadashi Komagata, Yasutoshi Nakagawa, John S. Petersen, "Writing wavy metal 1 shapes on 22-nm logic wafers with less shot count", Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 77480X (27 May 2010); doi: 10.1117/12.866971; https://doi.org/10.1117/12.866971
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KEYWORDS
Photomasks

Vestigial sideband modulation

Metals

SRAF

Data modeling

Semiconducting wafers

Optical proximity correction

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