16 November 2010 Laser ablation of maskant used in chemical milling process for aerospace applications
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Proceedings Volume 7751, XVIII International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers; 77511M (2010); doi: 10.1117/12.876386
Event: 18th International Symposium on Gas Flow and Chemical Lasers and High Power Lasers, 2010, Sofia, Bulgaria
Abstract
Chemical etching is a non-traditional machining process where a chemical solution is used to remove unwanted material by dissolution. To shape the etched area, before the process, a chemical inert paint (maskant) is applied on the surface. Then the maskant is trimmed away and the uncovered area is subject to the etching. The maskant cut could be obtained mechanically or by laser ablation. In this work, the effect of process parameters, cutting speed and beam power, on interaction phenomena and defect formation in laser cutting of polymeric maskant is studied, using a 30W CO2 laser source.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Leone, V. Lopresto, F. Memola Capece Minutolo, I. De Iorio, N. Rinaldi, "Laser ablation of maskant used in chemical milling process for aerospace applications", Proc. SPIE 7751, XVIII International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers, 77511M (16 November 2010); doi: 10.1117/12.876386; https://doi.org/10.1117/12.876386
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KEYWORDS
Aluminum

Industrial chemicals

Laser cutting

Laser ablation

Chemical reactions

Wet etching

Carbon dioxide lasers

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