17 August 2010 OTFT backplanes for integration into flexible displays
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Abstract
Recent developments in high performance organic semiconductor (OSC) materials have shown charge mobilities in the range of 2 to 5 cm2/Vs. We present our progress in fabricating organic thin film transistor (OTFT) backplanes using a low temperature process (100°C maximum) and the prospects for integration into flexible displays. Discussion is made of the fabrication process using typical flat panel display equipment as well as the possibility of further device enhancement using ink jet printing technologies. We show the feasibility of achieving an average panel mobility of >1 cm2/Vs on a range of transistor array sizes. Electrical data is presented to show how the parameters of interest, (mobility, on/off ratio, Vth), vary across an array as well as some of the scaling factors that will be important for the final device architecture. Finally, we discuss how these devices have the potential for integration into a range of displays (for example, e-paper and OLEDs) for commercial exploitation.
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Michael D. Cooke, Michael D. Cooke, Keri L. McCall, Keri L. McCall, David P. Bird, David P. Bird, Yong Uk Lee, Yong Uk Lee, Tim Pease, Tim Pease, Sam Y. F. Chan, Sam Y. F. Chan, Marco Palumbo, Marco Palumbo, Steve McGloin, Steve McGloin, Simon D. Ogier, Simon D. Ogier, "OTFT backplanes for integration into flexible displays", Proc. SPIE 7778, Organic Field-Effect Transistors IX, 777814 (17 August 2010); doi: 10.1117/12.862100; https://doi.org/10.1117/12.862100
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