Failure Analysis Of Raw Printed Circuit Boards Using Infrared Thermography

Vincent H. Williams; Daniel K. Fike

doi:10.1117/12.940507

11 May 1987 Failure Analysis Of Raw Printed Circuit Boards Using Infrared Thermography

Vincent H. Williams, Daniel K. Fike

Proceedings Volume 0780, Thermosense IX: Thermal Infrared Sensing for Diagnostics and Control; (1987) https://doi.org/10.1117/12.940507
Event: 1987 Technical Symposium Southeast on Optics, Electro-Optics, and Sensors, 1987, Orlando, FL, United States

Abstract

Modern technology and the need for faster systems has resulted in the design and manufacture of printed circuit boards (PCBs) having multiple layers of signal and power cores. The use of surface mounted components having differing operating voltages has dictated the need for PCBs that have both single and multi-voltage internal planes. The present manufacturing processes result in raw PCBs having power to power defects that occur both externally and internally. A need exists for a procedure that can accurately locate these defects. It should allow the capture of the defects with the least exposure of the board to any damage from the investigative and repair operations. Such a procedure, in order to reduce cost and maintain product flow, should be as automated as possible and be capable of being run by personnel from the manufacturing area. This paper deals with an Infrared Thermography application to address this need.

Citation Download Citation

Vincent H. Williams and Daniel K. Fike "Failure Analysis Of Raw Printed Circuit Boards Using Infrared Thermography", Proc. SPIE 0780, Thermosense IX: Thermal Infrared Sensing for Diagnostics and Control, (11 May 1987); https://doi.org/10.1117/12.940507

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