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24 September 2010 Advanced photomask cleaning for 32nm and beyond
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Abstract
High PRE (Particle removal efficiency) and damage free cleaning became main cleaning challenges over haze prevention in photomask industry, nowadays. SRAF (Sub-resolution assist feature) size became small down below 0.1um as pattern size become small. Acoustic frequency and power is the main parameter to increase PRE in photomask cleaning. 1 MHz of acoustic frequency was good enough to remove particles and soft defects until recently. But it has shown pattern damages for SB (Scattering bar) size of below 0.1um unfortunately. In this paper, we optimized photomask cleaning process to achieve high PRE and low pattern damage. Its haze prevention capability and cycle cleaning durability was verified with in-house-built HATB and AIMS, respectively.
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Jong-Min Kim, Young-Jin An, Dong-Seok Lee, Hyo-Jin Ahn, Hyun-Ju Jung, Jae-Chul Lee, Dong-Heok Lee, and Sang-Soo Choi "Advanced photomask cleaning for 32nm and beyond", Proc. SPIE 7823, Photomask Technology 2010, 78232X (24 September 2010); https://doi.org/10.1117/12.864532
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