Paper
3 November 2010 ICESat vegetation product evaluation with airborne lidar data in China
Yong Pang, Zengyuan Li, Michael Lefsky, Guoqing Sun, Qingwang Liu, Guangcai Xu
Author Affiliations +
Proceedings Volume 7841, Sixth International Symposium on Digital Earth: Data Processing and Applications; 784114 (2010) https://doi.org/10.1117/12.873247
Event: The Sixth International Symposium on Digital Earth, 2009, Beijing, China
Abstract
Spaceborne large footprint lidar (ICESat GLAS) has acquired over 250 million lidar observations over forest regions globally, an unprecedented dataset of vegetation heights. The ICESat Vegetation Product (IVP) was developed aimed at a global forest height dataset. Because of its high vertical resolution, large spatial extent and 70 m footprint characteristics, it is difficult to validate this product with other available remote sensing product or field measurements. To evaluation the IVP product in China, airborne waveform data was collected along several ICESat GLAS obits in the Southwest and West of China. The preliminary results show that the R2 is 0.41 and RMSE is 2.69 m between the vegetation height from airborne data and ICESat Vegetation Product at forest stand level in most cases. For those cases where the GLAS shots and airborne datasets gave very difference results, the airborne lidar data were synthesis to GLAS waveform and compared with the GLAS waveform. Those waveforms from fluctuated terrain also have several peaks and large waveform extent, which cased error in forest height estimation.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yong Pang, Zengyuan Li, Michael Lefsky, Guoqing Sun, Qingwang Liu, and Guangcai Xu "ICESat vegetation product evaluation with airborne lidar data in China", Proc. SPIE 7841, Sixth International Symposium on Digital Earth: Data Processing and Applications, 784114 (3 November 2010); https://doi.org/10.1117/12.873247
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KEYWORDS
LIDAR

Vegetation

Data centers

Data modeling

Laser systems engineering

Sensors

Error analysis

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