13 November 2010 Electromagnetic optimization of high-speed TO laser modules
Author Affiliations +
Proceedings Volume 7844, Semiconductor Lasers and Applications IV; 78440O (2010); doi: 10.1117/12.870549
Event: Photonics Asia 2010, 2010, Beijing, China
Abstract
The packaging aspect of the high-speed TO laser module has been investigated in this paper. A conventional TO 56 package is employed for compact and low cost high-speed applications. In the TO header, a special designed RF substrate is developed to minimize the RF reflection and insert loss. The influence of the feedthrough and the TO leads on signal transmission is analyzed using the electromagnetic (EM) method. A testing interface PCB based on the tapered coplanar waveguide (CPW) transmission line is proposed, and simulation results indicate that the coaxial type TO package has an insert loss of 1.5dB at 10GHz. In order to improve the electronic performance of the TO module, the equivalent circuit is built and a bandwidth compensation circuit is introduced, and results show that the 3dB bandwidth of the TO package can extend to 16.3GHz.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wei Han, Peter O'Brien, Marc Rensing, Hua Yang, Frank H. Peters, "Electromagnetic optimization of high-speed TO laser modules", Proc. SPIE 7844, Semiconductor Lasers and Applications IV, 78440O (13 November 2010); doi: 10.1117/12.870549; https://doi.org/10.1117/12.870549
PROCEEDINGS
7 PAGES


SHARE
KEYWORDS
Interfaces

Lead

Connectors

Electromagnetism

Reflection

Shape memory alloys

Signal attenuation

RELATED CONTENT

Ec-135 Fiber Optic Technology Review
Proceedings of SPIE (October 15 1984)
Surface multiplasmonics
Proceedings of SPIE (September 26 2011)
Automotive Fiber Optic Technology: Application Issues
Proceedings of SPIE (February 09 1989)

Back to Top