Vacuum packaging design and analysis for UFPA

Dafu Liu; Qinfei Xu

doi:10.1117/12.868893

16 November 2010 Vacuum packaging design and analysis for UFPA

Dafu Liu, Qinfei Xu

Author Affiliations +

Proceedings Volume 7847, Optoelectronic Devices and Integration III; 78471Y (2010) https://doi.org/10.1117/12.868893
Event: Photonics Asia 2010, 2010, Beijing, China

Abstract

Uncooled focal plane array (UFPA) has broad application prospects in civilian and space because it's cheaper, more compact and high reliability. Many research institutes and companies have carried out the research of uncooled focal plane array. This paper shows a vacuum package design of UFPA, and its architecture will be given. The assembly is an all-metal vacuum package, which has been proven rugged and reliable. Out-gassing, permeation, evaporator, and air leak are factors to reduce the component vacuum lifetime. Theoretical analysis shows that material out-gassing is the main factor of pressure rise inside package. Theoretical analysis and calculation show that designed metallic structure can meet the need of 10-years life.

Citation Download Citation

Dafu Liu and Qinfei Xu "Vacuum packaging design and analysis for UFPA", Proc. SPIE 7847, Optoelectronic Devices and Integration III, 78471Y (16 November 2010); https://doi.org/10.1117/12.868893

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