Testing device TST-05B, which is suitable for adaptability test of semiconductor devices, electronic products and other
military equipment under the condition of the surrounding air temperature rapidly changing, is used here for temperature
shock test.Thermal stability technology of thermoelectric cooler control circuit infrared sight under temperature shock is
studied in this paper. Model parameters and geometry is configured for ADI devices (ADN8830), welding material and
PCB which are used in system. Thermoelectric cooler control circuit packaged by CSP32 distribution are simulated and
analyzed by thermal shock and waveform through engineering finite element analysis software ANSYYS. Because
solders of the whole model have much stronger stress along X direction than that of other directions, initial stress
constraints along X direction are primarily considered when the partial model of single solder is imposed by thermal load.
When absolute thermal loads stresses of diagonal nodes with maximum strains are separated from the whole model,
interpolation is processed according to thermal loads circulation. Plastic strains and thermal stresses of nodes in both
sides of partial model are obtained. The analysis results indicates that with thermal load circulation, maximum forces of
each circulation along X direction are increasingly enlarged and with the accumulation of plastic strains of danger point,
at the same time structural deformation and the location of maximum equivalent plastic strain in the solder joints at the
first and eighth, the composition will become invalid in the end.