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9 November 2010 The optical design and simulation of multi-chip LED array package structure
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Based on the non-imaging particularities of LED optical sources , considering the impact of several factors respectively such as the distribution of chips, the size of the reflector and the refractive index of packaging material , the packaging of multi-chip LED array source is designed and simulated by using geometrical modeling for optical components and Monte Carlo non-sequence ray tracing method. In this paper put emphasis on the optical design of the packaging structure to the 2 × 2 LED array source, and get the different luminous efficiency and light intensity distributions by changing the packaging parameters of the model. The results showed that the distributions of light intensity under the different parameters have certain regularity. These laws have the practical guidance to the multi-chip LED lighting system design and production, and these are also helpful to reduce the experiment costs in LED packaging manufactures.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hong Wang, Li Chen, Feifei Ye, and Lijun Wang "The optical design and simulation of multi-chip LED array package structure", Proc. SPIE 7849, Optical Design and Testing IV, 784933 (9 November 2010);

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