Low cost heads-up virtual reality (HUVR) with optical tracking and haptic feedback

Todd Margolis; Thomas A. DeFanti; Greg Dawe; Andrew Prudhomme; Jurgen P. Schulze; Steve Cutchin

doi:10.1117/12.876584

27 January 2011 Low cost heads-up virtual reality (HUVR) with optical tracking and haptic feedback

Todd Margolis, Thomas A. DeFanti, Greg Dawe, Andrew Prudhomme, Jurgen P. Schulze, Steve Cutchin

Author Affiliations +

Proceedings Volume 7864, Three-Dimensional Imaging, Interaction, and Measurement; 786417 (2011) https://doi.org/10.1117/12.876584
Event: IS&T/SPIE Electronic Imaging, 2011, San Francisco Airport, California, United States

Abstract

Researchers at the University of California, San Diego, have created a new, relatively low-cost augmented reality system that enables users to touch the virtual environment they are immersed in. The Heads-Up Virtual Reality device (HUVR) couples a consumer 3D HD flat screen TV with a half-silvered mirror to project any graphic image onto the user's hands and into the space surrounding them. With his or her head position optically tracked to generate the correct perspective view, the user maneuvers a force-feedback (haptic) device to interact with the 3D image, literally 'touching' the object's angles and contours as if it was a tangible physical object. HUVR can be used for training and education in structural and mechanical engineering, archaeology and medicine as well as other tasks that require hand-eye coordination. One of the most unique characteristics of HUVR is that a user can place their hands inside of the virtual environment without occluding the 3D image. Built using open-source software and consumer level hardware, HUVR offers users a tactile experience in an immersive environment that is functional, affordable and scalable.

Citation Download Citation

Todd Margolis, Thomas A. DeFanti, Greg Dawe, Andrew Prudhomme, Jurgen P. Schulze, and Steve Cutchin "Low cost heads-up virtual reality (HUVR) with optical tracking and haptic feedback", Proc. SPIE 7864, Three-Dimensional Imaging, Interaction, and Measurement, 786417 (27 January 2011); https://doi.org/10.1117/12.876584

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