17 February 2011 Influence of Tm:YAP laser irradiation on tensile strength for bracket debonding
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Proceedings Volume 7884, Lasers in Dentistry XVII; 788404 (2011) https://doi.org/10.1117/12.873745
Event: SPIE BiOS, 2011, San Francisco, California, United States
Abstract
The investigation of tensile strength needed for bracket debonding was the aim of study. A diode pumped Tm: YAP microchip laser generating a continuous 2um radiation with the maximum output power of 4W was used for debonding purposes. The group of 60 brackets was debonded using classical and laser irradiation methods - the doze from 1W to 4 W, 60s. The tensile strength without laser irradiation was in the range from 39.6 N (full ceramic bracket group) to 63.7 N (ceramic bracket with metal slot group). After irradiation the tensile strength was decreased from 35.1 N (full ceramic bracket group) to 48.8 N (ceramic bracket with metal slot group). The results of our study generally agree with the previous studies, substantiating the fact that lasers can be used effectively to thermally soften the adhesive resin for removal of ceramic brackets. From the practical point of view is conclusion that during laser irradiation, thermal ablation occurs and the bracket is removed from the enamel together with the rest of the adhesive resin. Laser debonding is easier and little heat diffusion occurred.
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Tatjana Dostalova, Helena Jelinkova, Jan Sulc, Petr Koranda, Michal Nemec, Martin Fibrich, Michal Jelinek, Pavel Michalik, Mitsunobu Miyagi, "Influence of Tm:YAP laser irradiation on tensile strength for bracket debonding", Proc. SPIE 7884, Lasers in Dentistry XVII, 788404 (17 February 2011); doi: 10.1117/12.873745; https://doi.org/10.1117/12.873745
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