22 February 2011 Recent advances in VECSELs for laser projection applications
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Proceedings Volume 7919, Vertical External Cavity Surface Emitting Lasers (VECSELs); 79190D (2011); doi: 10.1117/12.877063
Event: SPIE LASE, 2011, San Francisco, California, United States
Abstract
Laser projectors integrated in portable devices offer a new platform for media display but put strong demands on the laser sources in terms of efficiency, modulation band width, operating temperature range and device cost. Osram Opto Semiconductors has developed and produces synthetic green lasers for projection applications on which the latest results are reported. Based on vertical external cavity surface emitting laser (VECSEL) technology and second harmonic generation an output power of >75mW has been achieved. The maximum output power is to a large extent limited by the high thermal resistance of the monolithic VECSEL chip used. To overcome the thermal limitations a new thinfilm VECSEL chip design is proposed where the epitaxial layers are transferred to a silicon carrier and processed on wafer level, thus significantly lowering the thermal resistance and improving the maximum output power.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
H. Lindberg, S. Illek, I. Pietzonka, M. Furitsch, A. Plößl, S. Haupt, M. Kühnelt, R. Schulz, U. Steegmüller, T. Höfer, U. Strauß, "Recent advances in VECSELs for laser projection applications", Proc. SPIE 7919, Vertical External Cavity Surface Emitting Lasers (VECSELs), 79190D (22 February 2011); doi: 10.1117/12.877063; https://doi.org/10.1117/12.877063
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KEYWORDS
Semiconducting wafers

Silicon

Semiconductor lasers

Laser applications

Mirrors

Gallium arsenide

Projection systems

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