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21 February 2011 Novel 1.2kW UV laser system for micro fabrication and annealing
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The growing demand for laser micro fabrication drives further requirements on higher production speed per part and lower manufacturing costs. A newly developed 1.2 kW 308 nm excimer laser addresses both micro-manufacturing and high production throughput. Solid state UV laser sources usually cannot emit UV laser radiation directly. The inherently required frequency conversion limits the total output power to several 10 Watts below 350 nm. Furthermore these UV-conversion- modules limit the long term reliability of high power UV solid state lasers significantly because of the wear of the conversion crystals. Excimer lasers, however, overcome these issues by direct emission at 308, 248, or 193 nm. By now up to 540 Watts at 308 nm are established in production. With the new laser we have more than doubled the available output power to 1.2 kW. The combination of short wavelength and highest available UV laser power makes it ideal for processing of small features or to modify thin surfaces. Furthermore, pulsed UV laser radiation is very suitable for removing delicate electronic devices from manufacturing substrates. High-power UV laser systems are capable of processing large areas with resolution down to several microns in one single laser ablation step without using multiple lithography and wet chemical processes. For instance, laser Lift-Off and large area annealing have proven to be very efficient manufacturing techniques for volume production. In this paper, a novel 1.2 kW excimer laser will be presented and discussed.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ludolf Herbst, Rainer Paetzel, and Kai Schmidt "Novel 1.2kW UV laser system for micro fabrication and annealing", Proc. SPIE 7920, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVI, 79200Z (21 February 2011);


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