15 February 2011 Impact of using filtration on global and local uniformity of spin on glue materials
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Proceedings Volume 7926, Micromachining and Microfabrication Process Technology XVI; 79260F (2011); doi: 10.1117/12.878757
Event: SPIE MOEMS-MEMS, 2011, San Francisco, California, United States
Abstract
Because of their high viscosity, spin on glue materials used for permanent and temporary bonding applications are usually difficult to dispense and filter at the point of use and achieve high quality, uniform, bubble-free coatings. In this paper, we will focus on the use of the IntelliGen® HV dispense system and its optimisation to improve the temporary bonding material coating uniformity. The system was first utilized without filtration to understand the effect of bubble introduction to the coating. The second phase of the project studied the impact of filtration on the quality of the coating when bubbles were introduced. Coating uniformity data were collected by a Senduro reflectometer and bubble defectivity studies were performed using the NandaTech® SPARK inspection tool.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. Bernard, R. A. Miller, V. Pepper, J. Braggin, F. F. C. Duval, "Impact of using filtration on global and local uniformity of spin on glue materials", Proc. SPIE 7926, Micromachining and Microfabrication Process Technology XVI, 79260F (15 February 2011); doi: 10.1117/12.878757; https://doi.org/10.1117/12.878757
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KEYWORDS
Semiconducting wafers

Particles

Reflectometry

Inspection

Intelligence systems

Microelectromechanical systems

Wafer bonding

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