11 February 2011 Revolutionary innovation in system interconnection: a new era for the IC
Author Affiliations +
This paper describes novel microscale electrical, optical, and fluidic interconnect networks to address off-chip interconnect challenges in high-performance computing systems as well as to enable 3D heterogeneous integration of CMOS and MEMS/sensors.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Muhannad S. Bakir, Muhannad S. Bakir, Paragkumar A. Thadesar, Paragkumar A. Thadesar, Calvin King, Calvin King, Jesal Zaveri, Jesal Zaveri, Hyung Suk Yang, Hyung Suk Yang, Chaoqi Zhang, Chaoqi Zhang, Yue Zhang, Yue Zhang, } "Revolutionary innovation in system interconnection: a new era for the IC", Proc. SPIE 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, 792803 (11 February 2011); doi: 10.1117/12.876823; https://doi.org/10.1117/12.876823


A hybrid MEMS-based microfluidic system for cancer diagnosis
Proceedings of SPIE (December 29 2008)
A new digital silicon MEMS gyroscope
Proceedings of SPIE (October 20 2009)
Wafer bonding for 3D integration of MEMS/CMOS
Proceedings of SPIE (January 05 2006)

Back to Top