15 February 2011 DLP/DSP-based optical 3D sensors for the mass market in industrial metrology and life sciences
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Proceedings Volume 7932, Emerging Digital Micromirror Device Based Systems and Applications III; 79320D (2011); doi: 10.1117/12.876987
Event: SPIE MOEMS-MEMS, 2011, San Francisco, California, United States
Abstract
GFM has developed and constructed DLP-based optical 3D measuring devices based on structured light illumination. Over the years the devices have been used in industrial metrology and life sciences for different 3D measuring tasks. This lecture will discuss integration of DLP Pico technology and DSP technology from Texas Instruments for mass market optical 3D sensors. In comparison to existing mass market laser triangulation sensors, the new 3D sensors provide a full-field measurement of up to a million points in less than a second. The lecture will further discuss different fields of application and advantages of the new generation of 3D sensors for: OEM application in industrial measuring and inspection; 3D metrology in industry, life sciences and biometrics, and industrial image processing.
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G. Frankowski, R. Hainich, "DLP/DSP-based optical 3D sensors for the mass market in industrial metrology and life sciences", Proc. SPIE 7932, Emerging Digital Micromirror Device Based Systems and Applications III, 79320D (15 February 2011); doi: 10.1117/12.876987; http://dx.doi.org/10.1117/12.876987
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KEYWORDS
3D image processing

Sensors

3D metrology

3D acquisition

Cameras

Inspection

Digital signal processing

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