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27 January 2011 GaAs-SOI integration as a path to low-cost optical interconnects
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Abstract
We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 μm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode).
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Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Mircea Guina, Kimmo Haring, Janne Puustinen, and Vladimir Mikhrin "GaAs-SOI integration as a path to low-cost optical interconnects", Proc. SPIE 7941, Integrated Optics: Devices, Materials, and Technologies XV, 79410S (27 January 2011); https://doi.org/10.1117/12.874644
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