1060nm VCSEL for inter-chip optical interconnection

Keishi Takaki; Suguru Imai; Shinichi Kamiya; Hitoshi Shimizu; Yasumasa Kawakita; Koji Hiraiwa; Tomohiro Takagi; Hiroshi Shimizu; Junji Yoshida; Takuya Ishikawa; Naoki Tsukiji; Akihiko Kasukawa

doi:10.1117/12.873662

3 February 2011 1060nm VCSEL for inter-chip optical interconnection

Keishi Takaki, Suguru Imai, Shinichi Kamiya, Hitoshi Shimizu, Yasumasa Kawakita, Koji Hiraiwa, Tomohiro Takagi, Hiroshi Shimizu, Junji Yoshida, Takuya Ishikawa, Naoki Tsukiji, Akihiko Kasukawa

Author Affiliations +

Proceedings Volume 7952, Vertical-Cavity Surface-Emitting Lasers XV; 795204 (2011) https://doi.org/10.1117/12.873662
Event: SPIE OPTO, 2011, San Francisco, California, United States

Abstract

The demand for the on board intra-chip optical interconnection as the "Green interconnect" have been growing so rapidly in order to catch up the speed of the performance development of high performance computing systems. In this report, our continuous study results expanding to intra-chip application in terms with power consumption and reliability are shown for the "Green" 1060nm VCSEL arrays developed by Furukawa Electric¹. As the basic performance level, the clear eye opening up to 20Gbps was achieved with low power dissipation level of 160fJ/bit with voltage swing level of 130mVpp. This value would be considered as the same level of the 140fJ/bit in 10Gbps operation with 75mVpp. In the reliability test, our large scale FIT rate test had been reached up to 7.8E7 device hours and the estimated FIT rate of 30FIT/ch was obtained from no failure sample and confidence level of 90%. Our wear-out study was performed with high stress test of 170°C ambient temperature and estimated failure rate for 10years service time was 0.3FIT/ch for this mode. Our 1060nm VCSEL with low power consumption level of 140fJ/bit and high reliability of 30FIT/ch would be projected to a light source for intra-chip application.

Citation Download Citation

Keishi Takaki, Suguru Imai, Shinichi Kamiya, Hitoshi Shimizu, Yasumasa Kawakita, Koji Hiraiwa, Tomohiro Takagi, Hiroshi Shimizu, Junji Yoshida, Takuya Ishikawa, Naoki Tsukiji, and Akihiko Kasukawa "1060nm VCSEL for inter-chip optical interconnection", Proc. SPIE 7952, Vertical-Cavity Surface-Emitting Lasers XV, 795204 (3 February 2011); https://doi.org/10.1117/12.873662

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available