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3 February 2011 1060nm VCSEL for inter-chip optical interconnection
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The demand for the on board intra-chip optical interconnection as the "Green interconnect" have been growing so rapidly in order to catch up the speed of the performance development of high performance computing systems. In this report, our continuous study results expanding to intra-chip application in terms with power consumption and reliability are shown for the "Green" 1060nm VCSEL arrays developed by Furukawa Electric1. As the basic performance level, the clear eye opening up to 20Gbps was achieved with low power dissipation level of 160fJ/bit with voltage swing level of 130mVpp. This value would be considered as the same level of the 140fJ/bit in 10Gbps operation with 75mVpp. In the reliability test, our large scale FIT rate test had been reached up to 7.8E7 device hours and the estimated FIT rate of 30FIT/ch was obtained from no failure sample and confidence level of 90%. Our wear-out study was performed with high stress test of 170°C ambient temperature and estimated failure rate for 10years service time was 0.3FIT/ch for this mode. Our 1060nm VCSEL with low power consumption level of 140fJ/bit and high reliability of 30FIT/ch would be projected to a light source for intra-chip application.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Keishi Takaki, Suguru Imai, Shinichi Kamiya, Hitoshi Shimizu, Yasumasa Kawakita, Koji Hiraiwa, Tomohiro Takagi, Hiroshi Shimizu, Junji Yoshida, Takuya Ishikawa, Naoki Tsukiji, and Akihiko Kasukawa "1060nm VCSEL for inter-chip optical interconnection", Proc. SPIE 7952, Vertical-Cavity Surface-Emitting Lasers XV, 795204 (3 February 2011);


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