7 April 2011 Towards defect free EUVL reticles: carbon and particle removal by single dry cleaning process and pattern repair by HIM
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Abstract
We report on our findings on EUVL reticle contamination removal, inspection and repair. We show that carbon contamination can be removed without damage to the reticle by our plasma process. Also organic particles, simulated by PSL spheres, can be removed from both the surface of the absorber as well as from the bottom of the trenches. The particles shrink in size during the plasma treatment until they are vanished. The determination of the necessary cleaning time for PSL spheres was conducted on Ru coated samples and the final experiment was performed on our dummy reticle. Finally we show that the Helium Ion Microscope in combination with a Gas Injection System is capable of depositing additional lines and squares on the reticle with sufficient resolution for pattern repair.
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N. B. Koster, F. T. Molkenboer, E. van Veldhoven, S. Oostrom, "Towards defect free EUVL reticles: carbon and particle removal by single dry cleaning process and pattern repair by HIM", Proc. SPIE 7969, Extreme Ultraviolet (EUV) Lithography II, 79690X (7 April 2011); doi: 10.1117/12.879216; https://doi.org/10.1117/12.879216
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