4 April 2011 Model-based mask data preparation (MB-MDP) and its impact on resist heating
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Proceedings Volume 7970, Alternative Lithographic Technologies III; 797012 (2011); doi: 10.1117/12.883122
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States
Abstract
Complex mask shapes will be required on critical layer masks for 20nm logic node, threatening to explode the mask write times. Model-Based Mask Data Preparation (MB-MDP) has been introduced to reduce the shot count required to write complex masks while simultaneously improving resolution and dose margin of sub-100nm features. For production use of MB-MDP, a number of questions have been raised and answered. This paper summarizes these potential issues and their resolutions. In particular, the paper takes an in-depth look at one of the questions: impact of overlapping shots on heating effect. The paper concludes that while heating effect is an important issue for all e-beam writing even with conventional non-overlapping shots, overall dose density per unit time over microns of space is the principal driver behind heating effects. Highly local shot density and shot sequencing does not affect heating significantly, particularly for smaller shots. MB-MDP does not introduce any additional concerns.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aki Fujimura, Takashi Kamikubo, Ingo Bork, "Model-based mask data preparation (MB-MDP) and its impact on resist heating", Proc. SPIE 7970, Alternative Lithographic Technologies III, 797012 (4 April 2011); doi: 10.1117/12.883122; https://doi.org/10.1117/12.883122
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KEYWORDS
Photomasks

Data modeling

Model-based design

Vestigial sideband modulation

Logic

Cadmium sulfide

Forward error correction

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