20 April 2011 High-order stitching overlay analysis for advanced process control
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Abstract
In recent years, layer-to-layer overlay methods moved from the linear regime into non-linear high-order methods in order to meet the shrinking overlay requirements. In this study we investigate a large number of metrology structures in the overlapped scribe-line between adjacent scanner fields and the opportunity for improved overlay performance. Sampling and modeling considerations are discussed. In this investigation we consider the opportunities for high-order stitching analysis in process control and scanner monitoring. The goal of this work is to establish a systematic methodology for high order stitching to characterize and reduce overlay errors for advanced IC manufacturing.
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Y. C. Pai, Charlie Chen, Louis Jang, Howard Chen, Chun-Chi Yu, Chin-Chou K. Huang, Hsing-Chien Wu, John C. Robinson, David Tien, "High-order stitching overlay analysis for advanced process control", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797127 (20 April 2011); doi: 10.1117/12.879360; https://doi.org/10.1117/12.879360
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