20 April 2011 The assessment of the impact of mask pattern shape variation on the OPC-modeling by using SEM-Contours from wafer and mask
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Abstract
As design rules shrink, Optical Proximity Correction (OPC) becomes complicated. As a result, measurement points have increased, and improving the OPC model quality has become more difficult. From the viewpoint of decreasing OPC calibration runtime and improving OPC model quality concurrently, Contour-based OPC-modeling is superior to CD-based OPC-modeling, because Contour-based OPC-modeling uses shape based rich information. Hence, Contour-based OPC-modeling is imperative in the next generation lithography, as reported in SPIE2010. In this study, Mask SEM-contours were input into OPC model calibration in order to verify the impact of mask pattern shape on the quality of the OPC model. Advanced SEM contouring technology was applied to both of Wafer CD-SEM and Mask CD-SEM in examining the effectiveness of OPC model calibration. The evaluation results of the model quality will be reported. The advantage of Contour based OPC modeling using Wafer SEM-Contour and Mask SEM-Contour in the next generation computational lithography will be discussed.
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Daisuke Hibino, Daisuke Hibino, Yutaka Hojyo, Yutaka Hojyo, Hiroyuki Shindo, Hiroyuki Shindo, Thuy Do, Thuy Do, Aasutosh Dave, Aasutosh Dave, Tim Lin, Tim Lin, Ir Kusnadi, Ir Kusnadi, John L. Sturtevant, John L. Sturtevant, } "The assessment of the impact of mask pattern shape variation on the OPC-modeling by using SEM-Contours from wafer and mask", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79712G (20 April 2011); doi: 10.1117/12.879030; https://doi.org/10.1117/12.879030
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