Metrology of micro-step height structures using 3D scatterometry in 4x-nm advance DRAM

Mason Duan; Clark Chen; Calvin Hsu; Elvis Wang; ZhiQing Xu; Elsie Yu; Qiongyan Yuan; Sungchul Yoo; Zhengquan Tan

doi:10.1117/12.881322

20 April 2011 Metrology of micro-step height structures using 3D scatterometry in 4x-nm advance DRAM

Mason Duan, Clark Chen, Calvin Hsu, Elvis Wang, ZhiQing Xu, Elsie Yu, Qiongyan Yuan, Sungchul Yoo, Zhengquan Tan

Proceedings Volume 7971, Metrology, Inspection, and Process Control for Microlithography XXV; 79712J (2011) https://doi.org/10.1117/12.881322
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

As DRAM design rules scale below 4Xnm, controlling the micro-step height caused by the etching process after patterning becomes more critical because it affects the post Chemical Mechanical Planarization (CMP) process window and furthermore affects yield. In this study, the latest Multi-Azimuth angle capability of Scatterometry Critical Dimension (SCD) was used to analyze the model of the micro-step height of nitride. SCD results were verified with Atomic Force Microscope (AFM) measurements.

Citation Download Citation

Mason Duan, Clark Chen, Calvin Hsu, Elvis Wang, ZhiQing Xu, Elsie Yu, Qiongyan Yuan, Sungchul Yoo, and Zhengquan Tan "Metrology of micro-step height structures using 3D scatterometry in 4x-nm advance DRAM", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79712J (20 April 2011); https://doi.org/10.1117/12.881322

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