20 April 2011 Diffraction-based overlay for spacer patterning and double patterning technology
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Overlay performance will be increasingly important for Spacer Patterning Technology (SPT) and Double Patterning Technology (DPT) as various Resolution Enhancement Techniques are employed to extend the resolution limits of lithography. Continuous shrinkage of devices makes overlay accuracy one of the most critical issues while overlay performance is completely dependent on exposure tool. Image Based Overlay (IBO) has been used as the mainstream metrology for overlay by the main memory IC companies, but IBO is not suitable for some critical layers due to the poor Tool Induced Shift (TIS) values. Hence new overlay metrology is required to improve the overlay measurement accuracy. Diffraction Based Overlay (DBO) is regarded to be an alternative metrology to IBO for more accurate measurements and reduction of reading errors. Good overlay performances of DBO have been reported in many articles. However applying DBO for SPT and DPT layers poses extra challenges for target design. New vernier designs are considered for different DPT and SPT schemes to meet overlay target in DBO system. In this paper, we optimize the design of the DBO target and the performance of DBO to meet the overlay specification of sub-3x nm devices which are using SPT and DPT processes. We show that the appropriate vernier design yields excellent overlay performance in residual and TIS. The paper also demonstrated the effects of vernier structure on overlay accuracy from SEM analysis.
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Byoung Hoon Lee, Byoung Hoon Lee, JeongSu Park, JeongSu Park, Jongsu Lee, Jongsu Lee, Sarohan Park, Sarohan Park, ChangMoon Lim, ChangMoon Lim, Dong-Gyu Yim, Dong-Gyu Yim, Sungki Park, Sungki Park, Chan-Ho Ryu, Chan-Ho Ryu, Stephen Morgan, Stephen Morgan, Maurits van de Schaar, Maurits van de Schaar, Andreas Fuchs, Andreas Fuchs, Kaustuve Bhattacharyya, Kaustuve Bhattacharyya, } "Diffraction-based overlay for spacer patterning and double patterning technology", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79712U (20 April 2011); doi: 10.1117/12.870473; https://doi.org/10.1117/12.870473

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