15 April 2011 Fundamental investigation of negative tone development (NTD) for the 22nm node (and beyond)
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Abstract
In this work, we investigate the Negative Tone Develop (NTD) process from a fundamental materials/process interaction perspective. Several key differences exist between a negative tone develop process and a traditional positive tone develop system. For example, the organic solvent dissolves the unexposed material, while the deprotected resist remains intact. This causes key differences in key patterning properties, such as pattern collapse, adhesion, remaining resist, and photoresist etch selectivity. We have carried out fundamental studies to understand these new interactions between developer and remaining resist with negative tone develop systems. We have characterized the dynamic dissolution behavior of a model system with a quartz crystal microbalance with both positive and negative tone solvent developers. We have also compared contrast curves, and a fundamental model of image collapse. In addition, we present first results on Optical Proximity Correction (OPC) modeling results of current Negative Tone Develop (NTD) resist/developer systems.
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Guillaume Landie, Guillaume Landie, Yongan Xu, Yongan Xu, Sean Burns, Sean Burns, Kenji Yoshimoto, Kenji Yoshimoto, Martin Burkhardt, Martin Burkhardt, Larry Zhuang, Larry Zhuang, Karen Petrillo, Karen Petrillo, Jason Meiring, Jason Meiring, Dario Goldfarb, Dario Goldfarb, Martin Glodde, Martin Glodde, Anthony Scaduto, Anthony Scaduto, Matthew Colburn, Matthew Colburn, Jason Desisto, Jason Desisto, Young Bae, Young Bae, Michael Reilly, Michael Reilly, Cecily Andes, Cecily Andes, Vaishali Vohra, Vaishali Vohra, } "Fundamental investigation of negative tone development (NTD) for the 22nm node (and beyond)", Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 797206 (15 April 2011); doi: 10.1117/12.882843; https://doi.org/10.1117/12.882843
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