22 March 2011 Mask enhancer technology with source mask optimization (SMO) for 2Xnm-node logic layout gate fabrication
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Abstract
Strong resolution enhancement technologies (RETs) combined with hyper-NA ArF immersion lithography with source and mask optimization (SMO) have become necessary to achieve sufficient resolution in 2Xnm node devices. Conventional SMO methods have focused on minimizing the edge placement error and/or the cost functions of dose, focus, and mask errors. This has not, however, resolved the conflict between line and gap patterns on logic gate layouts. One issue remaining in particular is the mask error enhancement factor (MEEF). Furthermore, the pattern shapes at the line end gaps of SRAM gates remain a major challenge for logic device manufacturers. To overcome these problems, we explain the importance of controlling the light intensity profiles at line end gaps, focusing on a Panasonic product called "Mask Enhancer" that comprises an attenuated mask with a phase shifting aperture and enables light intensity profiles to be controlled easily. We demonstrate the product's effectiveness in printing gates with optimized illumination source shapes. A simulation experiment and a feasibility study confirmed that Mask Enhancer can improve the MEEF and pattern shapes at the line ends of SRAM gates.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takashi Matsuda, Takashi Matsuda, Shigeo Irie, Shigeo Irie, Tadami Shimizu, Tadami Shimizu, Takashi Yuito, Takashi Yuito, Yasuko Tabata, Yasuko Tabata, Yuuji Nonami, Yuuji Nonami, Akio Misaka, Akio Misaka, Taichi Koizumi, Taichi Koizumi, Masaru Sasago, Masaru Sasago, } "Mask enhancer technology with source mask optimization (SMO) for 2Xnm-node logic layout gate fabrication", Proc. SPIE 7973, Optical Microlithography XXIV, 797316 (22 March 2011); doi: 10.1117/12.878727; https://doi.org/10.1117/12.878727
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