Paper
22 March 2011 Hotspot fixing using ILT
Author Affiliations +
Abstract
For low k1 lithography the resolution of critical patterns on large designs can require advanced resolution enhancement techniques for masks including scattering bars, complicated mask edge segmentation and placement, etc. Often only a portion of a large layout will need this sophisticated mask design (the hotspot), with the remainder of layout being relatively simple for OPC methods to correct. In this paper we show how inverse lithography technology (ILT) can be used to correct selected regions of a large design after standard OPC has been used to correct the simple portions of the layout. The hotspot approach allows a computationally intensive ILT to be used in a limited way to correct the most difficult portions of a design. We will discuss the most important issues such as: model matching between ILT and OPC corrections; transition region corrections near the ILT and OPC boundary region; mask complexity; total combined runtime. We will show both simulated and actual wafer lithographic improvements in the hotspot regions.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Woojoo Sim, Sunggon Jung, Hyun-Jong Lee, Sungsoo Suh, Jung-Hoon Ser, Seong-Woon Choi, Chang-Jin Kang, Thomas Cecil, Christopher Ashton, David Irby, Xin Zhou, D.H. Son, Guangming Xiao, and David Kim "Hotspot fixing using ILT", Proc. SPIE 7973, Optical Microlithography XXIV, 79731L (22 March 2011); https://doi.org/10.1117/12.879781
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Photomasks

Optical proximity correction

Semiconducting wafers

Photovoltaics

Data modeling

Lithography

SRAF

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