1 April 2011 Augmented reality for wafer prober
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Proceedings Volume 7985, 27th European Mask and Lithography Conference; 79850M (2011) https://doi.org/10.1117/12.882521
Event: 27th European Mask and Lithography Conference, 2011, Dresden, Germany
The link between wafer manufacturing and wafer test is often weak: without common information system, Test engineers have to read locations of test structures from reference documents and search them on the wafer prober screen. Mask Data Preparation team is ideally placed to fill this gap, given its relationship with both design and manufacturing sides. With appropriate design extraction scripts and design conventions, mask engineers can provide exact wafer locations of all embedded test structures to avoid a painful camera search. Going a step further, it would be a great help to provide to wafer probers a "map" of what was build on wafers. With this idea in mind, mask design database can simply be provided to Test engineers; but the real added value would come from a true integration of real-wafer camera views and design database used for wafer manufacturing. As proven by several augmented reality applications, like Google Maps' mixed Satellite/Map view, mixing a real-world view with its theoretical model is very useful to understand the reality. The creation of such interface can only be made by a wafer prober manufacturer, given the high integration of these machines with their control panel. But many existing software libraries could be used to plot the design view matching the camera view. Standard formats for mask design are usually GDSII and OASIS (SEMI P39 standard); multiple free software and commercial viewers/editors/libraries for these formats are available.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Pascal Gilgenkrantz, "Augmented reality for wafer prober", Proc. SPIE 7985, 27th European Mask and Lithography Conference, 79850M (1 April 2011); doi: 10.1117/12.882521; https://doi.org/10.1117/12.882521

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