26 May 2011 Micro-displacement measurement based on electronic speckle
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Proceedings Volume 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering; 79972R (2011) https://doi.org/10.1117/12.891859
Event: Fourth International Seminar on Modern Cutting and Measuring Engineering, 2010, Beijing, China
The method to measure micro-displacement based on Electronic Speckle is theoretically analyzed. An interferometer system is set up for measuring in-plane displacement of the measured surface, where the charge-coupled device (CCD) is used for image acquisition. It is well known that there are strong grain-shape random noises in the speckle patterns, which make heavy influence on the visibility and resolution of speckle fringes. Hence the technique of image processing is important to improve the contrast of the speckle fringes. For this reason, good experimental conditions are required to capture better speckle patterns; then image filtering and Fourier transformation are used to process the patterns. It is proved that the method in this paper can effectively improve the measurement results.
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Xiaoping Lang, Xiaoping Lang, Xiaoying Li, Xiaoying Li, } "Micro-displacement measurement based on electronic speckle", Proc. SPIE 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering, 79972R (26 May 2011); doi: 10.1117/12.891859; https://doi.org/10.1117/12.891859

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