26 May 2011 Analysis of the polishing slurry flow of chemical mechanical polishing by polishing pad with phyllotactic pattern
Author Affiliations +
Proceedings Volume 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering; 79972V (2011) https://doi.org/10.1117/12.883091
Event: Fourth International Seminar on Modern Cutting and Measuring Engineering, 2010, Beijing, China
Abstract
In order to make the polishing slurry distribution more uniform over the polishing region, a new kind of polishing pad, which has sunflower seed pattern, has been designed based on the phyllotaxis theory of biology, and the boundary conditions of polishing slurry flow have been established. By the help of computational fluid dynamics software (FLUENT), the flow state of the polishing slurry is simulated and the effects of the phyllotactic parameters of polishing pad on the flow field of polishing slurry are analyzed. The results show that when the polishing slurry is imported from the center of phyllotaxis polishing pad, the slurry flows along the counterclockwise and clockwise spiral grooves of phyllotatic pattern, which make fluid flow divergence around, and the flow field becomes more uniform.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yushan Lv, Yushan Lv, Tian Zhang, Tian Zhang, Jun Wang, Jun Wang, Nan Li, Nan Li, Min Duan, Min Duan, Xue-Ling Xing, Xue-Ling Xing, } "Analysis of the polishing slurry flow of chemical mechanical polishing by polishing pad with phyllotactic pattern", Proc. SPIE 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering, 79972V (26 May 2011); doi: 10.1117/12.883091; https://doi.org/10.1117/12.883091
PROCEEDINGS
6 PAGES


SHARE
Back to Top