8 September 2011 Systematic approach for tolerance analysis of photonic systems
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Proceedings Volume 8007, Photonics North 2011; 80071E (2011) https://doi.org/10.1117/12.902756
Event: Photonics North 2011, 2011, Ottawa, Canada
Abstract
Passive alignment of photonic components is an assembly method compatible with a high production volume. Its precision performance relies completely on the dimensional accuracies of geometrical alignment features. A tolerance analysis plays a key role in designing and optimizing these passive alignment features. The objective of this paper is to develop a systematic approach for conducting such tolerance analysis, starting with a conceptual package design, setting up the tolerance chain, describing it mathematically and converting the misalignment to a coupling loss probability distribution expressed in dB. The method has successfully been applied to a case study where an indium phosphide (InP) chip is aligned with a TriPleX1 (SiO2 cladding with Si3N4 core) interposer via a silicon optical bench (SiOB).
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. F. C. van Gurp, M. Tichem, U. Staufer, "Systematic approach for tolerance analysis of photonic systems", Proc. SPIE 8007, Photonics North 2011, 80071E (8 September 2011); doi: 10.1117/12.902756; https://doi.org/10.1117/12.902756
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