A novel atomic layer deposition method to fabricate economical and robust large area microchannel plates

Anil U. Mane; Qing Peng; Matthew J. Wetstein; Robert G. Wagner; Henry J. Frisch; Oswald H. W. Siegmund; Michael J. Minot; Bernhard W. Adams; Matthieu C. Chollet; Jeffrey W. Elam

doi:10.1117/12.882885

13 May 2011 A novel atomic layer deposition method to fabricate economical and robust large area microchannel plates

Anil U. Mane, Qing Peng, Matthew J. Wetstein, Robert G. Wagner, Henry J. Frisch, Oswald H. W. Siegmund, Michael J. Minot, Bernhard W. Adams, Matthieu C. Chollet, Jeffrey W. Elam

Author Affiliations +

Proceedings Volume 8031, Micro- and Nanotechnology Sensors, Systems, and Applications III; 80312H (2011) https://doi.org/10.1117/12.882885
Event: SPIE Defense, Security, and Sensing, 2011, Orlando, Florida, United States

Abstract

We demonstrate a cost-effective and robust route to fabricate large-area microchannel plate (MCP) detectors, which will open new potential in larger area MCP-based detector technologies. For the first time, using our newly developed process flow we have fabricated large area (8"x8") MCPs. We used atomic layer deposition (ALD), a powerful thin film deposition technique, to tailor the electrical resistance and secondary electron emission (SEE) properties of large area, low cost, borosilicate glass capillary arrays. The self limiting growth mechanism in ALD allows atomic level control over the thickness and composition of resistive and SEES layers that can be deposited conformally on high aspect ratio capillary glass arrays. We have developed several robust and reliable ALD processes for the resistive coatings and SEE layers to give us precise control over the resistance (10⁶-10¹⁰Ω) and SEE coefficient (up to 5). This novel approach allows the functionalization of microporous, insulating substrates to produce MCPs with high gain and low noise. These capabilities allow a separation of the substrate material properties from the amplification properties. Here we describe a complete process flow to produce large area MCPs.

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Anil U. Mane, Qing Peng, Matthew J. Wetstein, Robert G. Wagner, Henry J. Frisch, Oswald H. W. Siegmund, Michael J. Minot, Bernhard W. Adams, Matthieu C. Chollet, and Jeffrey W. Elam "A novel atomic layer deposition method to fabricate economical and robust large area microchannel plates", Proc. SPIE 8031, Micro- and Nanotechnology Sensors, Systems, and Applications III, 80312H (13 May 2011); https://doi.org/10.1117/12.882885

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