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5 May 2011 Microelectro discharge machining: an innovative method for the fabrication of 3D microdevices
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Proceedings Volume 8066, Smart Sensors, Actuators, and MEMS V; 806621 (2011)
Event: SPIE Microtechnologies, 2011, Prague, Czech Republic
This paper reports on the potential of microelectro discharge machining (μEDM) as an innovative method for the fabrication of 3D microdevices. To demonstrate the wide capabilities of μEDM two different high-potential 3D microsystems - a microfluidic device for the dispersion of nanoparticles and a star probe for microcoordinate metrology - are presented. For the fabrication of these microdevices a μEDM-milling machine with integrated microwire electro discharge grinding (μWEDG) module is utilized. To gain optimized process conditions as well as a high surface quality an adequate adaption of the single erosion parameters such as energy, pulse frequency and spark gap has to be carried out and are discussed below. The dispersion micromodule is used for pharmaceutical screening applications in a high pressure range up to 2000 bar. At the channel bottom a surface roughness of Ra = 80 nm is achieved. In case of the star probe it is possible to produce shaft and sphere out of one piece. The fabricated stylus elements have sphere diameters of 40-200 μm. For both applications μEDM offers a flexible, precise, effective and cost-efficient fabrication method for the machining of hard and resistant materials.
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Claudia Lesche, Thomas Krah, and Stephanus Büttgenbach "Microelectro discharge machining: an innovative method for the fabrication of 3D microdevices", Proc. SPIE 8066, Smart Sensors, Actuators, and MEMS V, 806621 (5 May 2011);

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