17 September 1987 Practical Photolithography For Modern Semiconductor Production
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Proceedings Volume 0811, Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection; (1987) https://doi.org/10.1117/12.975596
Event: Fourth International Symposium on Optical and Optoelectronic Applied Sciences and Engineering, 1987, The Hague, Netherlands
Abstract
The impact of some photolithographic processing parameters on the final production results in the modern semiconductor device manufacture and also their definition, is discussed under the aspect that microlithographic manufacturing processes are working closer to the limits of the technology. Quality engineering includes good characterization of all manufacturing steps, of all used equipment and materials, in order to minimize the appearance of variances arising either from inside or being imported from outside sources. The objective is to have fully controlled and understood processes, which yield well performing semiconductor devices at reasonable costs in todays production and which will allow further technological progress in the microelectronics industry.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Walter G. Hertlein, Walter G. Hertlein, } "Practical Photolithography For Modern Semiconductor Production", Proc. SPIE 0811, Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection, (17 September 1987); doi: 10.1117/12.975596; https://doi.org/10.1117/12.975596
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